- 11 2062 5010 / 48 3512 0278
- Atendimento: Segunda à sexta das 8h às 17h
2MBI 75UA-120 é módulo IGBT FUJI de comutação de alta velocidade.
Features– High speed switching- Voltage drive- Low inductance module structureApplications– Inverter for Motor Drive- AC and DC Servo drive amplifier- Uninterruptible power supply- Industrial machines, such as Welding machines
Maximum ratings and characteristics
| Item | Symbol | Conditions | Rating | Unit |
| Collector-emitter voltage | Vces | – | 1200 | V |
| Gate-emitter voltage | Vges | – | +-20 | V |
| Collector current | Ic | Continuos Tc=25ºC | 100 | A |
| Continuos Tc=80ºC | 75 | |||
| Icp | 1ms Tc=25ºC | 200 | ||
| 1ms Tc=80ºC | 150 | |||
| -Ic | 75 | |||
| -Ic pulse | 150 | |||
| Collector power dissipation | Pc | 1 device | 400 | W |
| Junction temperature | Tj | – | +150 | ºC |
| Storage temperature | Tstg | – | -40 to +125 | ºC |
| Isolation voltage *¹ | Viso | AC:1min. | 2500 | VAC |
| Screw torque | Item Mounting *² | 3.5 | N·m | |
| Item Terminals *² | 3.5 | N·m |
Note: *¹ between terminal and cooper base – all terminals should be connected together when isolation test will be done; *² recommendable value: 2.5 to 3.5 N·m(m5)
Electrical characteristics (at Tj=25ºC)
| Items | Symbols | Characteristics | Conditions | Units | ||
| Min. | Typ. | Max. | ||||
|
Zero gate voltagecollector current |
Ices | – | – | 1.0 |
Vge = 0VVce = 1200V |
mA |
| Gate-emitter leakage current | Iges | – | – | 200 |
Vce = 0VVge = +- 20V |
nA |
| Gate-emitter threshold package | Vge (t.h) | 4.5 | 6.5 | 8.5 |
Vce = 20VIc = 75mA |
V |
| Collector-emitter saturation voltage | Vce (sat) terminal Tj=25ºC | – | 1.9 | 2.25 |
Vge = 15VIc = 75A |
V |
| Vce (sat) terminal Tj=125ºC | – | 2.15 | – | |||
| Vce (sat) chip Tj=25ºC | – | 1.75 | 2.10 | |||
| Vce (sat) chip Tj=125ºC | – | 2.00 | – | |||
| Input capacitance | Cies | – | 8 | – |
Vce=10V, Vge=0V, f=1MHz |
nF |
| Turn-on time | Ton | – | 0.36 | 1.20 |
Vcc=600V Ic=75A Vge=+-15V Rg=9.1Ω
|
μS |
| Tr | – | 0.21 | 0.60 | |||
| Tr(i) | – | 0.03 | – | |||
| Turn-off time | Toff | – | 0.37 | 1.00 | ||
| Tr | – | 0.07 | 0.30 | |||
| Forward on voltage | Vf (terminal) Tj=25ºC | – | 1.75 | 2.05 |
Vge=0V If=75A
|
V |
| Vf (terminal) Tj=125ºC | – | 1.85 | – | |||
| Vf (chip) Tj=25ºC | – | 1.60 | 1.90 | |||
| Vf (chip) Tj=125ºC | – | 1.70 | – | |||
| Reverse recovery time | trr | – | – | 0.35 |
If=75A |
μS |
| Lead resistance, terminal-chip *³ | Rlead | – | 1.39 | – |
|
mΩ |
Note: *³ this is the value which is defined mounting on the additional cooling fin with thermal compound.
Thermal resistance characteristics
| Items | Symbols | Characteristics | Conditions | Units | ||
| Min. | Typ. | Max. | ||||
| Thermal resistance | Rth (j-c) | – | – | 0.31 | IGBT | ºC/W |
| Rth (j-c) | – | – | 0.48 | FWD | ||
| Contact thermal resistance | Rth (c-f) *? | – | 0.05 | – | with thermal compound |
Note: *? this is the value which is defined mounting on the additional cooling fin with thermal compound.
